WUS Printed Circuit Kunshan Co Ltd
- Industrie
- PCBs & Substrates
- Bourse
- Shenzhen
- Pays / Région
- China
- Date d'introduction en bourse
- 18 août 2010
- Effectif
- 15 243
- Site web
- www.wustec.com
Fourchette de valorisation composite · prudent ¥23.6–¥26.9 / raisonnable ¥39.4–¥44.9 / optimiste ¥94.3–¥107.4. À ¥117.5, Au-dessus du plafond optimiste · croissance future déjà escomptée.
À la publication ¥133.22 (9 juin 2026)
Données EODHD, présentées dans la devise de reporting ; à titre indicatif uniquement, ne constitue pas un conseil en investissement.
Wus Printed Circuit (Kunshan) Co., Ltd. engages in the production, sale, and related after-sales services of various printed circuit boards in China. The company offers backplane, line card, server products, antenna, high density interconnect, hybrid products, heat sinks, and heavy copper. Its products are used in automotive, power supply, computer, wireless telecommunications infrastructure, wired core network, semiconductor, and industrial applications. The company was incorporated in 1992 and is based in Kunshan, China.
Historique
WUS Printed Circuit (Kunshan) Co., Ltd. (沪电股份) was incorporated in 1992 and is based in Kunshan, China, producing and selling various printed circuit boards. It listed on 2010-08-18 and employs 15,243 people. Its product line spans backplane, line card, server products, antenna, high density interconnect, hybrid products, heat sinks and heavy copper, serving automotive, power supply, computer, wireless and wired telecommunications, semiconductor and industrial applications. From 2021 to 2025 revenue grew from 7.419 billion to 18.945 billion yuan, a compound rate of about 26%, while net profit attributable to shareholders rose to 3.822 billion yuan, a compound rate of about 38%. The company is advancing a Thailand base and over 10 billion yuan of expansion projects.
Position dans le secteur
The company describes itself as China's largest high-end printed circuit board maker, concentrated on data-communication and data-center PCBs. In 2025 it ranked first globally in data-communication PCBs with revenue of US$2.150 billion and a roughly 7.0% share, and first in data-center PCBs with revenue of US$2.012 billion and about a 10.2% share. In the high-layer-count segment it ranked first in 22-layer-and-above MLPCBs with US$0.7248 billion of revenue and about a 14.9% share. The 2025 global data-communication PCB market reached US$31.8 billion, or 37.3% of the total PCB market. Overseas sales accounted for 82.1% of 2025 revenue.
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