BE Semiconductor Industries NV
- Industrie
- AI Advanced Packaging
- Bourse
- Amsterdam
- Pays / Région
- Netherlands
- Date d'introduction en bourse
- 4 décembre 1995
- Effectif
- 1 902
- Site web
- www.besi.com
Fourchette de valorisation composite · prudent €55–€80 / raisonnable €80–€120 / optimiste €130–€170. À €205.1, Au-dessus du plafond optimiste · croissance future déjà escomptée.
À la publication €288.4 (4 juin 2026)
Données EODHD, présentées dans la devise de reporting ; à titre indicatif uniquement, ne constitue pas un conseil en investissement.
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
Historique
BE Semiconductor Industries N.V. (Besi) was incorporated in 1995 and is headquartered in Duiven, the Netherlands; it completed its IPO on 4 December 1995. The company develops, manufactures, sells, and services back-end semiconductor assembly equipment, operating through three segments: Die Attach, Packaging, and Plating, and selling under the Fico, Meco, Datacon, and Esec brands. It runs operations across the Netherlands, Switzerland, Austria, Singapore, Malaysia, and other markets, built around a structure of European R&D combined with Asian manufacturing and supply chain. Richard W. Blickman has served as CEO since 1995, giving the company unusually long management continuity across multiple industry cycles. Headcount rose from 1,964 at the end of 2025 to 2,217 in Q1 2026, mainly through expansion of fixed and temporary staff in Asia to support recovering orders and hybrid bonding activity. Since 2011 the company has returned approximately EUR 2.4 billion to shareholders through dividends and buybacks; in 2025 Applied Materials acquired a 9% stake, framed as a long-term strategic relationship building on four years of prior hybrid bonding collaboration.
Position dans le secteur
Besi is a leading supplier of back-end advanced packaging and assembly equipment, with its products spanning die sorting, die bonding, molding, plating, trimming/forming, and singulation. In 2024 the company disclosed a share of roughly 82% in the die attach segment and roughly 50% in advanced die placement; it has also stated that about 70% of equipment revenue comes from advanced packaging, about 60% from advanced die placement, and about 50% is AI-related. Its customers are primarily IDMs, foundries and OSAT (assembly subcontractors), and large electronics and industrial companies, with meaningful customer concentration: the top ten customers accounted for 53% of revenue in 2021 (including one customer at 10.6%) and 52% in 2023, while a single customer represented 14.7% of revenue in 2024. Besi's competitive differentiation rests on engineering reputation and equipment reliability as a B2B brand, through-cycle profitability supported by Asian manufacturing and lower capital intensity, scale advantages in die attach and advanced die placement, and high switching costs arising from long customer qualification cycles, process and line matching, yield ramp, and demanding precision and throughput requirements, especially in hybrid bonding, advanced die placement, and TCB. Its closest comparable competitors are ASMPT and Kulicke & Soffa (KLIC).
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