2026년 6월 8일
Contract
Confirmed
黑芝麻智能与上实科技签署具身智能战略合作
Black Sesame signed a strategic partnership with SIIC Technology to build an embodied AI ecosystem and Hong Kong robotics platform.
Possible impact:May affect expectations for commercialization of its robotics compute platform and cross-border ecosystem expansion.
2026년 6월 5일
Product
Confirmed
黑芝麻智能发布SesameX Kalos商用服务机器人平台
Black Sesame introduced SesameX Kalos, a commercial service robot platform positioned for cost-effective mass deployment.
Possible impact:May affect expectations for expansion from auto chips into robotics applications.
2026년 6월 1일
Product
Confirmed
黑芝麻智能推出SesameX Aura机器人通用计算平台
Black Sesame launched SesameX Aura, a general compute platform for multi-task robots in dynamic operating environments.
Possible impact:May affect expectations for its embodied AI product lineup and new application scenarios.
2026년 5월 18일
Regulatory
Confirmed
华山A2000U、A2000X获ISO 26262 ASIL-D认证
Black Sesame said its Huashan A2000U and A2000X AD chips received ISO 26262 ASIL-D functional safety certification.
Possible impact:May affect confidence in its high-end AD chips entering automaker supply chains.
2026년 4월 26일
Contract
Confirmed
黑芝麻智能与如祺出行达成L4无人驾驶战略合作
Black Sesame partnered with Ruqi Mobility on localized L4 computing platforms, algorithm optimization and Robotaxi commercialization.
Possible impact:May affect expectations for commercialization of its L4 Robotaxi computing solutions.
Automatically summarized from public sources; for context only, not investment advice.