2026年6月8日
Contract
Confirmed
黑芝麻智能与上实科技签署具身智能战略合作
Black Sesame signed a strategic partnership with SIIC Technology to build an embodied AI ecosystem and Hong Kong robotics platform.
Possible impact:May affect expectations for commercialization of its robotics compute platform and cross-border ecosystem expansion.
2026年6月5日
Product
Confirmed
黑芝麻智能发布SesameX Kalos商用服务机器人平台
Black Sesame introduced SesameX Kalos, a commercial service robot platform positioned for cost-effective mass deployment.
Possible impact:May affect expectations for expansion from auto chips into robotics applications.
2026年6月1日
Product
Confirmed
黑芝麻智能推出SesameX Aura机器人通用计算平台
Black Sesame launched SesameX Aura, a general compute platform for multi-task robots in dynamic operating environments.
Possible impact:May affect expectations for its embodied AI product lineup and new application scenarios.
2026年5月18日
Regulatory
Confirmed
华山A2000U、A2000X获ISO 26262 ASIL-D认证
Black Sesame said its Huashan A2000U and A2000X AD chips received ISO 26262 ASIL-D functional safety certification.
Possible impact:May affect confidence in its high-end AD chips entering automaker supply chains.
2026年4月26日
Contract
Confirmed
黑芝麻智能与如祺出行达成L4无人驾驶战略合作
Black Sesame partnered with Ruqi Mobility on localized L4 computing platforms, algorithm optimization and Robotaxi commercialization.
Possible impact:May affect expectations for commercialization of its L4 Robotaxi computing solutions.
Automatically summarized from public sources; for context only, not investment advice.