JCET Group Co Ltd
- Industry
- AI Advanced Packaging
- Exchange
- Shanghai
- Country
- China
- IPO date
- May 19, 2003
- Employees
- 24,952
- Website
- www.jcetglobal.com
Composite valuation range · conservative ¥38–¥48 / fair ¥55–¥70 / optimistic ¥79–¥88. At ¥82.35, Within the optimistic intrinsic-value range · much expectation priced in.
At publication ¥84.69 (Jul 22, 2026)
Data from EODHD, shown in the reporting currency; for reference only, not investment advice.
JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit back-end and technology services in China, South Korea, the United States, and internationally. The company offers turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments; design solutions; and characterization services, such as mold flow, mechanical, and electrical analysis, as well as thermal analysis test. It also provides packaging solutions comprising wirebond, flip chip, wafer level, power device, and MEMS and sensors packaging, as well as wafer bumping, system-in-package, and advancement of mainstream package; and testing solutions, which include test platform, wafer sort, test development, and ITMS, as well as RF, mixed-signal, memory/3D, digital, strip, post, and final tests. In addition, the company is involved in sewage treatment; investment activities; and trading. Its products are used in automotive, computing, storage, edge AI, and power and energy applications. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin, China.
History
JCET Group Co., Ltd. (full legal name Jiangsu Changjiang Electronics Technology Co., Ltd.) was founded in 1972 and is based in Jiangyin, China; its roots trace to the Jiangyin transistor factory, the area's earliest integrated-circuit enterprise, which evolved into today's company. The present listed entity was established on 6 November 1998, completed its joint-stock restructuring in 2000, and listed on the Shanghai Stock Exchange on 3 June 2003. In 2015, together with the National Integrated Circuit Industry Investment Fund and SilTech Semiconductor, JCET privatized Singapore-listed STATS ChipPAC via a voluntary conditional general offer, for an equity consideration of about US$780 million and an enterprise value of about US$1.8 billion; the Shanghai Stock Exchange described it as the first cross-border acquisition of a top-tier international packaging and testing company by an A-share listed company. The deal transformed JCET from a regional Chinese packaging house into a global OSAT with coordinated production capacity across China, Singapore and South Korea and an international customer base. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. Following the acquisition, revenue grew from RMB 23.526 billion in 2019 to a record RMB 38.871 billion in 2025, while net income attributable to shareholders moved from RMB 89 million in 2019 to RMB 1.304 billion (2020), RMB 2.959 billion (2021), RMB 3.231 billion (2022), RMB 1.471 billion (2023), RMB 1.610 billion (2024) and RMB 1.565 billion (2025). In 2024, China Resources, through Panshi Hong Kong / Panshi Runqi, took control of JCET with a stake of about 22.54%. As of the end of 2025 the company had 24,952 employees.
Industry position
JCET Group is one of the world's top-three OSAT (outsourced semiconductor assembly and test) providers, supplying integrated-circuit back-end and technology services across China, South Korea, the United States and internationally. It offers turnkey solutions spanning semiconductor package integration design, wafer probing, bumping, assembly, final testing and global drop shipment, alongside characterization and testing services; its packaging portfolio includes wirebond, flip chip, wafer level, power device, MEMS and sensors packaging, wafer bumping, system-in-package and advancement of mainstream packages. Its products serve automotive, computing, storage, edge AI, and power and energy applications. The company's competitive position rests on a global manufacturing and delivery network across Singapore, South Korea and China inherited from the STATS ChipPAC acquisition; an integrated design-packaging-testing capability such as its XDFOI high-density heterogeneous integration platform; and qualified high-volume manufacturing for international customers. By 2023 JCET had disclosed that its XDFOI Chiplet process had entered stable mass production and that it had shipped 4nm multi-chip system-integration packaging for an international customer, with an organic redistribution-layer interposer minimum line width/spacing of about 2μm. Its principal competitors include ASE Technology (3711.TW), the largest global OSAT; Amkor (AMKR.US), a U.S.-centric OSAT; and Chinese peers Tongfu Microelectronics (002156.SHE) and Tianshui Huatian (002185.SHE). JCET also faces competition from wafer foundries' in-house advanced packaging, such as TSMC (2330.TW), as the profit pool for the highest-end packaging is not exclusive to OSAT firms.