Powertech Technology Inc
- Industry
- AI Advanced Packaging
- Exchange
- Taiwan
- Country
- Taiwan
- Website
- www.pti.com.tw
Composite valuation range · conservative 180–220 / fair 240–310 / optimistic 320–390. At 279, Within the fair intrinsic-value range.
At publication 333 (Jun 11, 2026)
Data from EODHD, shown in the reporting currency; for reference only, not investment advice.
Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
History
Powertech Technology Inc. was founded in May 1997, began operations in September 1997, and is headquartered in Hsinchu City, Taiwan. It started with DRAM and Flash test orders from 力晶 and 旺宏, then added packaging capability around 2000 to become a turnkey packaging-and-test provider. The company entered the emerging-stock market in 2002, listed on the TPEx in April 2003, moved to the Taiwan Stock Exchange in November 2004, and issued GDS in Luxembourg in 2006. It later expanded its back-end network by acquiring about 34.48% of Tera Probe in 2016 and 100% of Micron Akita in 2017 (renamed Powertech Technology Akita), launched its FOPLP mass-production base in 2018, and sold its Suzhou majority stake (2023) and Xi'an plant to Micron (effective July 1, 2024).
Industry position
Powertech Technology is a Taiwan-based OSAT centered on memory (DRAM/NAND) back-end packaging and testing, while also doing logic and advanced packaging. In 2025 revenue was TWD 74.929 billion, with packaging services at 61.76%, test services at 13.95%, and module services at 10.77%. Its customer base is concentrated, with the top three customers accounting for roughly 51% of 2025 revenue. The grounding positions it among global OSAT players alongside 日月光, Amkor, and 长电科技, describing it as more focused on memory back-end than full-line OSATs.