Perfil de la empresa · Technology

Shengyi Technology Co Ltd

600183 · Shanghái
Bolsa
Shanghái
País / Región
China
Fecha de salida a bolsa
16 de septiembre de 1998
Empleados
14.523
Precio actual
¥125.99
En vivo · 27 de julio de 2026
Compra razonable
≤ ¥21
Entrada con margen de seguridad
Puntuación de crecimiento Baillie
43/100
Floja
Valor intrínseco · Rango en tres niveles Precio actual ¥125.99 En vivo · Por encima del techo optimista · crecimiento futuro sobregirado

Rango de valoración compuesto · conservador ¥15–¥20 / razonable ¥25–¥35 / optimista ¥50–¥70. A ¥125.99, Por encima del techo optimista · crecimiento futuro sobregirado.

Al publicar ¥145 (9 de junio de 2026)

Capitalización288,35 mil M CNY
Ingresos (TTM)30,96 mil M CNY
EBITDA5935,01 M CNY
Margen neto12,69 %
ROE24,44 %
PER (TTM)73,73
PER previsto85,47
PEG0,85
BPA1,61 CNY
Rentabilidad por dividendo0,96 %
Rango de 52 semanas38,14 CNY – 191,88 CNY

Datos de EODHD, mostrados en la moneda de reporte; solo a título informativo, no constituye asesoramiento de inversión.

Shengyi Technology Co.,Ltd. engages in the design, production, and sales of copper clad laminates, bonding sheets, and printed circuit boards in China and internationally. The company offers flame-retardant epoxy glass fabric reinforced laminates, composite epoxy materials, and flexible circuit materials, as well as prereg for multilayer circuit boards; and smart and rigid materials, automotive and RF materials, IMS and HTC materials, IC substrate and flexible materials, HSD materials, and special materials. It also provides high-end electronic materials, such as prepregs, insulating laminates, metal-based copper clad foil laminates, resin-coated copper foil, and covering films. The company's products are primarily used in high computing power, AI servers, 5G antennas, base stations, computers, servers, the aerospace industry, chip packaging, automotive electronics, smart homes, industrial control medical equipment, home appliances, consumer terminals, and various electronic products. It also exports its products to America, Europe, Korea, Japan, and Southeast Asia. The company was formerly known as Guangdong Shengyi Sci. Tech Co., Ltd. Shengyi Technology Co.,Ltd. was founded in 1985 and is headquartered in Dongguan, China.

Historia

Shengyi Technology Co Ltd was founded in 1985 and is headquartered in Dongguan, China; it was formerly known as Guangdong Shengyi Sci. Tech Co., Ltd. The company listed via IPO on 16 September 1998 and employs 14,523 people. It designs, produces, and sells copper clad laminates, bonding sheets, and printed circuit boards in China and internationally, with products used in AI servers, 5G antennas and base stations, automotive electronics, and chip packaging, and exports to America, Europe, Korea, Japan, and Southeast Asia.

Posición en el sector

Shengyi is one of China's leading copper clad laminate (CCL) makers; per Prismark, its 2022 rigid-CCL sales ranked second globally with a market share of about 12%. In 2025 revenue was 28.4 billion yuan and net profit attributable to shareholders was about 3.334 billion yuan, with CCL and bonding sheets contributing 17.774 billion yuan and printed circuit boards 9.144 billion yuan. R&D spending in 2025 was 1.450 billion yuan, or 5.10% of revenue, with 2,031 R&D staff. Domestic peers include 南亚新材 and 华正新材.

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