Amkor Technology Inc
- Отрасль
- AI Advanced Packaging
- Биржа
- США
- Страна / Регион
- USA
- Дата IPO
- 29 апреля 1998 г.
- Сотрудники
- 30 800
- Сайт
- amkor.com
Сводный диапазон оценки · консервативный $42–$55 / справедливый $60–$78 / оптимистичный $85–$105. При $60.71, В пределах справедливого диапазона внутренней стоимости.
На момент публикации $73.82 (5 июня 2026 г.)
Данные EODHD, показаны в валюте отчётности; только для справки, не является инвестиционной рекомендацией.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
История
Amkor Technology (NASDAQ: AMKR) traces its roots to a semiconductor packaging business founded in 1968 by Korean-American entrepreneur James J. Kim, growing from the Kim family's packaging operation into one of the first companies to build the outsourced packaging-and-test model at scale. Headquartered in Tempe, Arizona, the company went public on April 29, 1998. The Kim family still controls about 49.4% of the company (holding roughly 122.7 million of 247.9 million shares as of April 21, 2026) through a single-class share structure with no dual-class voting rights; in October 2024 founder James J. Kim stepped down as executive chairman and Susan Y. Kim succeeded him as chairman. During the 2000s Amkor became a core Apple packaging supplier, particularly in system-in-package (SiP), a relationship that endures today with Apple accounting for roughly 30% of revenue (29.8% in 2025, 30.8% in 2024, 27.7% in 2023). A strategic turning point came in November 2023, when the company announced an advanced packaging plant in Arizona and signed an MoU with TSMC, repositioning itself within the U.S. semiconductor supply chain; the Arizona campus investment grew to roughly USD 7 billion in total. Management transitioned again as Kevin Engel, a packaging-and-test veteran promoted from COO in 2025, became CEO effective January 1, 2026 (succeeding Giel Rutten), with Megan Faust as CFO. Today Amkor employs about 30,800 people.
Положение в отрасли
Amkor is the world's second-largest outsourced semiconductor assembly and test (OSAT) provider and the largest U.S.-listed OSAT company; in 2024 it held about 15.2% of the top-10 OSAT players' revenue (approximately USD 6.3 billion), behind ASE at 44.6% (around USD 18.5 billion) and ahead of JCET, Tongfu Microelectronics and Powertech. Rather than designing chips or making wafers, the company takes finished dies from foundries and IC design firms and performs packaging and test, serving integrated device manufacturers, fabless companies, OEMs and contract foundries. Advanced packaging (such as high-density fan-out and 2.5D) accounts for about 83% of revenue (FY2025: USD 5.56 billion of USD 6.71 billion total). Its sources of competitive advantage rest on grounded facts: the scarcity of large-scale domestic advanced packaging capacity in the United States, where its Arizona campus is the largest U.S. outsourced advanced packaging facility (supported by CHIPS Act direct funding of up to USD 407 million, co-located near TSMC's Arizona fab, with Apple as the first and largest anchor customer and Nvidia also among customers); long customer qualification cycles and high switching costs in advanced packaging technologies (2.5D, HDFO, TSV, SiP); and a multi-country manufacturing footprint spanning Korea, Japan, Vietnam, China, the Philippines, Taiwan, Portugal and Malaysia plus the U.S. Arizona site. The highest-value advanced packaging for AI accelerators (CoWoS-S/SoIC) is largely internalized by TSMC, which outsources simpler process steps to ASE and Amkor when its own capacity is full; Amkor's 10-K identifies the risk that key customers may turn to foundries that also offer packaging and test. Intel has also begun outsourcing EMIB advanced packaging to Amkor's Korean operations.
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